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Uni-Dimensional Vapor Chamber for Compact Systems

Uni-Dimensional Vapor Chamber for Compact Systems

  • Efficient heat dissipation with advanced vapor chamber technology
  • Customizable sizes and configurations for diverse applications
  • High thermal conductivity improves device performance
  • Designed for seamless integration in electronic devices
  • Durable construction ensures longevity and reliability
  • Get instant quote now

    Product Detail

    Products Details

    Grade
    6000 Series
    Tolerance
    ±1%
    Delivery Time
    15-25days
    Temper
    T3-T8
    Application
    Fan, led light, eletrical appliances
    Shape
    round
    Alloy Or Not
    Is Alloy
    Processing Service
    Bending, Welding, Punching, Cutting, Stamping, Die Casting
    Style
    Custom personalized
    MOQ
    1TON
    Thickness
    0.8-5mm
    Process
    Extrusion
    Shipping
    By sea/air
    Surface treatment
    Anodized, powder coating, wood grain
    Type
    100% QC Testing
    OEM Service
    Available
    Service
    24 hours online
    Certification
    ISO9001, CE, ROHS, Testing reports
    Selling Units
    Single item
    Single package size
    50X50X30 cm
    Single gross weight
    1.300 KG

    Our Manufacturing Base

    Factory Panorama

    Aluminum Bar Manufacturing Workshop

    Mold Storage Warehouse

    43 Aluminum Extrusion Lines (500–5500 Tons)

    Powder Coating Workshop

    Anodizing Workshop

    Deep Processing Workshop

    CNC Precision Machining Workshop

    Finished Product & Export Warehouse

    FAQ

    1. What is the primary purpose of the Uni-Dimensional Vapor Chamber?
    The vapor chamber is designed to efficiently dissipate heat in electronic devices, improving their performance and lifespan.

    2. Can the vapor chamber be customized for specific applications?
    Yes, it can be customized in size and configuration to fit various devices and applications.

    3. Is the vapor chamber compatible with all types of electronic devices?
    It is compatible with a wide range of devices, but customization may be needed for specific models.

    4. How does the vapor chamber improve device performance?
    By efficiently dissipating heat, it reduces thermal throttling and allows electronic components to run at optimal speeds.

    5. What materials are used in the construction of this vapor chamber?
    The chamber is typically made from copper or aluminum for high thermal conductivity.

    6. Is this vapor chamber suitable for high-performance computers?
    Yes, it is ideal for high-performance computers needing superior thermal management.

    7. Do you offer technical support for integrating the vapor chamber?
    Yes, we provide technical assistance to ensure successful integration into your systems.

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