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Thermal Transfer Plate Heat Sink for Devices

Thermal Transfer Plate Heat Sink for Devices

  • Efficient thermal management for electronic devices
  • Customizable design to fit specific cooling requirements
  • Manufactured using high-quality, durable materials
  • Suits a wide range of applications in various industries
  • Supports bulk orders with competitive pricing options
  • Get instant quote now

    Product Detail

    Products Details

    machinery test report
    Provided
    video outgoing-inspection
    Provided
    warranty
    1 Year
    application
    Heater Parts
    type
    liquid cold plate
    weight (kg)
    5
    Product name
    cold plate heat sink
    Material
    Aluminum alloy
    Dimension(L*W*H)
    Up to 1.2*1m L*W
    Surface roughness
    3.2 um
    Surface flatness
    0.1 mm
    Working pressure
    At least 1 bar
    Main technique
    CNC machining
    Bonding technique
    Vacuum brazing
    Coolant
    Deionized Water,Inhibited Glycol and Water,Dielectric fluid
    Surface finish
    Mill finish or anodization
    Selling Units
    Single item
    Single package size
    21X14X11 cm
    Single gross weight
    5.000 KG

    Our Manufacturing Base

    Factory Panorama

    Aluminum Bar Manufacturing Workshop

    Mold Storage Warehouse

    43 Aluminum Extrusion Lines (500–5500 Tons)

    Powder Coating Workshop

    Anodizing Workshop

    Deep Processing Workshop

    CNC Precision Machining Workshop

    Finished Product & Export Warehouse

    FAQ

    1. What is the primary function of the Thermal Transfer Plate Heat Sink?
    Its primary function is to dissipate heat effectively to maintain optimal device performance.

    2. Can the design of the heat sink be customized?
    Yes, the design can be tailored to meet specific cooling demands of different applications.

    3. What materials are used in the construction of the heat sink?
    It is made from high-quality materials like aluminum or copper for effective thermal conduction.

    4. Is the heat sink suitable for high-power electronic components?
    Yes, it is engineered to handle high thermal loads common in high-power components.

    5. Do you offer prototype services before mass production?
    Yes, we provide prototype development to ensure the design meets your requirements.

    6. How does the thermal efficiency of this product compare to others?
    It offers superior thermal efficiency due to its optimized design and material choice.

    7. Are there any minimum order quantities for purchasing?
    Yes, there are MOQs, which vary depending on customization and order specifics.

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