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Køleplader med limede finner

Ultra-High Fin Density: Bonded fin heat sinks achieve aspect ratios up to 44:1 or higher, greatly increasing surface area and improving heat dissipation efficiency compared to traditional extruded heat sinks

Superior Thermal Performance: These heat sinks can reduce thermal resistance by up to 50-66%, making them ideal for compact, high-power applications requiring exceptional cooling performance

Flexible Material Options: Supports both aluminum and copper fins, or hybrid combinations like copper fins on an aluminum base, optimizing between cost, weight, and thermal conductivity

Customizable Fin & Base Design: Fins are fabricated from sheet or extrusion and bonded into a grooved aluminum or copper base, allowing complete customization of fin height, spacing, and thickness

Reliable Bonding Methods: Fins are attached using thermally conductive epoxy, soldering, or brazing-selected based on thermal requirements, structural integrity, and production scale

Low Thermal Resistance Capability: Designed to perform in forced-air environments with thermal resistance as low as 0.0175 Â°C/W, suitable for IGBT modules and power electronics

Compatibility with Active Cooling Systems: Bonded fin heat sinks can be integrated with fans, heat pipes, vapor chambers, or liquid cooling solutions for advanced thermal management

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Køleplader med limede finner Produkt

Muligheder for tilpasning

We provide tailored bonded fin heat sinks for high-performance applications, offering advanced design flexibility in materials, fin geometry, bonding methods, and system-level integration.

Fin Aspect Ratio: Up to 44:1 or higher for maximum surface area
Fin Materials: Aluminum, copper, or hybrid metal configurations
Base Materials: Aluminum or copper, extruded or machined options
Bonding Methods: Thermally conductive epoxy, soldering, or brazing
Fin Fabrication: Customizable height, thickness, spacing, and profile shape
Integration af køling: Supports heat pipe, vapor chamber, fan, or liquid-cooled system integration
Termisk modstand: Target values as low as 0.0175 Â°C/W under forced convection

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Hvorfor samarbejde med Sinoextrud om din Køleplader med limede finner Behov?

Vi er mere end bare en leverandør af aluminiumsprofiler - vi er din effektive, pålidelige og langsigtede partner.

Hos os får du:Hurtigere ekspedition,Stabil kvalitet,Konkurrencedygtige priser,End-to-end-support.

Produktion i stor skala：.Vores fabrik strækker sig over 1.000 mu (ca. 667.000 m²)med fuld in-house kapacitet fra aluminiumsmeltning og støbning af emner til ekstrudering, overfladebehandling og CNC-bearbejdning.

One-stop-løsning：.Med 43 ekstruderingslinjer (500-5500 tons) og en dedikeret skimmelpartner leverer vi hurtig produktion, tilpassede profiler og integrerede tjenester til forenkle din forsyningskæde.

Kvalitet, du kan stole på：.Streng kvalitetskontrol sikrer Ensartede dimensioner, styrke og finishDet reducerer din risiko og øger pålideligheden.

Hurtig levering og omkostningseffektivitet:.Egenproducerede billets, in-house forarbejdning og serieproduktion betyder hurtigere leveringstider og lavere samlede omkostninger.

Avancerede efterbehandlingsmuligheder：.Anodisering og både lodrette og vandrette pulverlakeringslinjer leverer holdbare overfladebehandlinger af høj kvalitet skræddersyet til dine produktbehov.

Oversigt over fabrikker

Ovnværksted

Produktion af aluminiumsstænger

Lager for skimmelsvampe

500-5500 tons ekstruder

Sprøjteværksted

Anodiseringsværksted

Workshop om dyb behandling

CNC-bearbejdningsværksted

Lager for færdige varer

Lager for færdige varer

Lager for færdige varer

Eksportlager

5500 tons ekstruderingspresse

Presse til ekstrudering af aluminium

Stor ekstruderingslinje for aluminium

Produktionslinje til ekstrudering af aluminium

Ekstruderingsværksted

IATF 16949-certificering

TUV

Lager for færdige varer

Eksportlager

-Mulighed for standardpakning

* Profiler med lang stanglængde 3,0-6,0 meter*.

Beskyttende film

Krympemuffe

Brunt papir

Håndværkspapir

* Korte stanglængdeprofiler på 0,3-3,0 meter*.

EPE-skum

Polybag

Kasse af træ

Trææske

-Indlæsning og forsendelse

Lastning af paller

Bulk-læsning

LCL-læsning

Hurtig ekspedition

TRIN

Sådan arbejder du sammen med os

Start et projekt i dag

Tilbud og estimering
Begynd med en grundig evaluering af designets gennemførlighed, efterfulgt af et hurtigt, detaljeret overslag.
Prøve og test
Oprettelse af en prototype for at vurdere dimensioner og sikre, at formens præcision stemmer overens med kravene.
Ekstrudering og finish
Producerer aluminiumsprofilen med stor nøjagtighed i henhold til de givne specifikationer og anvender den ønskede finish.
Pakke og levere
Skræddersyet emballage til de ekstruderede profiler, der sikrer sikker og effektiv læsning til hurtig levering.

Køleplader med limede finner-FAQ'er

What is a bonded fin heat sink?

It is a high-density heat sink where individual fins are bonded into a grooved base, enabling greater thermal surface area than standard extrusions.

What materials can be used for the fins and base?

Aluminum and copper are commonly used; combinations like copper fins with aluminum bases are also available.

What bonding methods are used?

Depending on application needs, fins are bonded using thermal epoxy, soldering, or brazing.

What are the thermal benefits of bonded fin heat sinks?

They can reduce thermal resistance by 50-66% compared to conventional heat sinks, enhancing performance in compact layouts.

Are they suitable for high-power forced-air systems?

Yes, bonded fin sinks perform well under forced convection with extremely low thermal resistance values.

Can I request a custom size or fin layout?

Absolutely-fin geometry, spacing, height, and material combinations can be fully customized to meet thermal and dimensional constraints.

Can bonded fin sinks be used with other cooling systems?

Yes, they can be paired with fans, vapor chambers, heat pipes, or liquid cooling to maximize heat dissipation.

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Sinoextrud: Din Køleplader med limede finner Producent

Køleplader med limede finner provide advanced thermal solutions for applications where traditional extrusion profiles fall short. Their high fin density and customizable design offer significant cooling performance advantages in constrained spaces.

These heat sinks are ideal for high-power electronics, lighting modules, and industrial controls-delivering low thermal resistance and scalable design options. Whether using copper, aluminum, or hybrid assemblies, they enable optimal balance between weight and conductivity.

Bonding methods such as epoxy, soldering, or brazing ensure strong thermal paths and durable mechanical bonds, while allowing designers freedom to specify precise fin geometry, aspect ratios, and base configurations.

For enhanced system integration, bonded fin designs support additional cooling technologies like fans, heat pipes, or vapor chambers-resulting in greater thermal performance under dynamic environmental conditions.

With full customization, fast prototyping, and reliable production capabilities, bonded fin heat sinks are the go-to solution for thermal engineers demanding performance, precision, and design flexibility.

Køleplader med limede finner : Den ultimative FAQ-guide

Startform 200KG