{"id":25106,"date":"2025-10-27T15:26:51","date_gmt":"2025-10-27T07:26:51","guid":{"rendered":"https:\/\/sinoextrud.com\/?p=25106"},"modified":"2025-10-27T15:27:23","modified_gmt":"2025-10-27T07:27:23","slug":"mohu-pouzit-chladic-bez-tepelne-pasty-na-procesory-nebo-mosfety","status":"publish","type":"post","link":"https:\/\/sinoextrud.com\/cs\/can-i-use-a-heat-sink-without-thermal-paste-on-cpus-or-mosfets\/","title":{"rendered":"Mohu na procesory nebo tranzistory MOSFET pou\u017e\u00edt chladi\u010d bez tepeln\u00e9 pasty?"},"content":{"rendered":"

\"\u010dern\u00e1
Stylov\u00e1 \u010dern\u00e1 ko\u017een\u00e1 d\u00e1msk\u00e1 kabelka s nastaviteln\u00fdm popruhem a zlat\u00fdm kov\u00e1n\u00edm<\/figcaption><\/figure>\n<\/p>\n

Pokud jste v poku\u0161en\u00ed vynechat p\u0159i mont\u00e1\u017ei chladi\u010de tepelnou pastu, zastavte se - mohlo by v\u00e1s to st\u00e1t v\u00edce, ne\u017e si mysl\u00edte.<\/p>\n

Pou\u017eit\u00ed chladi\u010de bez tepeln\u00e9 pasty vytv\u00e1\u0159\u00ed mikroskopick\u00e9 vzduchov\u00e9 mezery, kter\u00e9 zachycuj\u00ed teplo, co\u017e vede k tepeln\u00e9 ne\u00fa\u010dinnosti a mo\u017en\u00e9mu po\u0161kozen\u00ed za\u0159\u00edzen\u00ed.<\/strong><\/p>\n

M\u016f\u017ee se zd\u00e1t, \u017ee je chladi\u010d pevn\u011b p\u0159ipojen, ale kontakt kov na kov nen\u00ed dokonal\u00fd. Bez tepeln\u00e9 pasty nebude teplo generovan\u00e9 procesory nebo tranzistory MOSFET unikat dostate\u010dn\u011b rychle, co\u017e zp\u016fsob\u00ed p\u0159eh\u0159\u00e1t\u00ed a krat\u0161\u00ed \u017eivotnost za\u0159\u00edzen\u00ed.<\/p>\n

Co je to term\u00e1ln\u00ed pasta a jak funguje?<\/h2>\n

Lid\u00e9 si \u010dasto mysl\u00ed, \u017ee chladi\u010d s\u00e1m o sob\u011b odvede dobrou pr\u00e1ci, ale tepeln\u00e1 pasta hraje v tomto syst\u00e9mu z\u00e1sadn\u00ed roli.<\/p>\n

Tepeln\u00e1 pasta je teplovodiv\u00e1 sm\u011bs nanesen\u00e1 mezi za\u0159\u00edzen\u00ed a chladi\u010d, kter\u00e1 eliminuje vzduchov\u00e9 mezery a zlep\u0161uje p\u0159enos tepla.<\/strong><\/p>\n

\"tmav\u011b
Stylov\u00e1 tmav\u011b modr\u00e1 d\u017e\u00ednov\u00e1 bunda s kovov\u00fdmi knofl\u00edky a klasick\u00fdm st\u0159ihem<\/figcaption><\/figure>\n<\/p>\n

I ty nejhlad\u0161\u00ed povrchy maj\u00ed drobn\u00e9 nedokonalosti. V t\u011bchto mikrotrhlin\u00e1ch se zachycuje vzduch, kter\u00fd je \u0161patn\u00fdm vodi\u010dem tepla. Tepeln\u00e1 pasta tyto mezery vypln\u00ed a vytvo\u0159\u00ed tak lep\u0161\u00ed cestu, kterou teplo putuje od \u010dipu k chladi\u010di.<\/p>\n

Kl\u00ed\u010dov\u00e9 vlastnosti:<\/h3>\n\n\n\n\n\n\n\n
Funkce<\/th>\nFunkce<\/th>\n<\/tr>\n<\/thead>\n
Vysok\u00e1 tepeln\u00e1 vodivost<\/td>\n\u00fa\u010dinn\u011b p\u0159en\u00e1\u0161\u00ed teplo mezi povrchy<\/td>\n<\/tr>\n
Viskozita<\/td>\nZaji\u0161\u0165uje rozt\u00edratelnost bez \u00faniku<\/td>\n<\/tr>\n
Stabilita<\/td>\nZachov\u00e1v\u00e1 konzistenci p\u0159i tepeln\u00fdch cyklech<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

B\u011b\u017en\u00e9 typy term\u00e1ln\u00edch past:<\/h3>\n\n\n\n\n\n\n\n\n
Typ<\/th>\nZ\u00e1kladn\u00ed materi\u00e1l<\/th>\nNejlep\u0161\u00ed pro<\/th>\n<\/tr>\n<\/thead>\n
Na b\u00e1zi keramiky<\/td>\nSilikon a keramika<\/td>\nObecn\u00e1 elektronika, n\u00edzk\u00fd rozpo\u010det<\/td>\n<\/tr>\n
Na b\u00e1zi kov\u016f<\/td>\nSt\u0159\u00edbro nebo hlin\u00edk<\/td>\nVysoce v\u00fdkonn\u00e9 procesory CPU nebo GPU<\/td>\n<\/tr>\n
Na b\u00e1zi uhl\u00edku<\/td>\nGrafit nebo uhl\u00edk<\/td>\nVyv\u00e1\u017een\u00e1 tepeln\u00e1 a elektrick\u00e1 bezpe\u010dnost<\/td>\n<\/tr>\n
Tekut\u00fd kov<\/td>\nSlitina galia<\/td>\nExtr\u00e9mn\u00ed chlazen\u00ed, pouze pro odborn\u00e9 pou\u017eit\u00ed<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

<\/svg> Tepeln\u00e1 pasta zlep\u0161uje p\u0159enos tepla t\u00edm, \u017ee odstra\u0148uje vzduchov\u00e9 kapsy.<\/b>Pravda<\/span><\/p>

Vypl\u0148uje mikroskopick\u00e9 mezery mezi kovov\u00fdmi povrchy, kter\u00e9 by jinak zadr\u017eovaly teplo.<\/p><\/div>\n

<\/svg> Pokud se chladi\u010d dot\u00fdk\u00e1 p\u0159\u00edmo za\u0159\u00edzen\u00ed, nepot\u0159ebujete tepelnou pastu.<\/b>False<\/span><\/p>

P\u0159\u00edm\u00fd kontakt st\u00e1le zanech\u00e1v\u00e1 mikrotrhliny, kter\u00e9 sni\u017euj\u00ed \u00fa\u010dinnost p\u0159enosu tepla.<\/p><\/div>\n

Jak\u00e9 jsou v\u00fdhody pou\u017e\u00edv\u00e1n\u00ed term\u00e1ln\u00ed pasty?<\/h2>\n

P\u0159esto\u017ee se jedn\u00e1 o malou sou\u010d\u00e1stku, hraje term\u00e1ln\u00ed pasta obrovskou roli ve stabilit\u011b a v\u00fdkonu syst\u00e9mu.<\/p>\n

Tepeln\u00e1 pasta zaji\u0161\u0165uje konzistentn\u00ed p\u0159enos tepla, zabra\u0148uje p\u0159eh\u0159\u00edv\u00e1n\u00ed a pom\u00e1h\u00e1 udr\u017eet spolehliv\u00fd provoz p\u0159i vysok\u00e9m zat\u00ed\u017een\u00ed.<\/strong><\/p>\n

\"modr\u00fd
M\u00f3dn\u00ed modr\u00fd ko\u017een\u00fd vintage batoh s n\u011bkolika p\u0159ihr\u00e1dkami a nastaviteln\u00fdmi popruhy<\/figcaption><\/figure>\n<\/p>\n

Ze sv\u00fdch zku\u0161enost\u00ed se zak\u00e1zkov\u00fdmi pr\u016fmyslov\u00fdmi \u0159\u00eddic\u00edmi jednotkami jsem vid\u011bl, \u017ee se syst\u00e9my vypnuly jen proto, \u017ee n\u011bkdo zapomn\u011bl nan\u00e9st nebo vym\u011bnit tepelnou pastu. Je snadn\u00e9 ji p\u0159ehl\u00e9dnout, ale pro tepelnou regulaci je nezbytn\u00e1.<\/p>\n

Hlavn\u00ed v\u00fdhody:<\/h3>\n\n\n\n\n\n\n\n\n
Benefit<\/th>\nVysv\u011btlen\u00ed<\/th>\n<\/tr>\n<\/thead>\n
Lep\u0161\u00ed tepeln\u00fd kontakt<\/td>\nSni\u017euje odpor mezi za\u0159\u00edzen\u00edm a d\u0159ezem<\/td>\n<\/tr>\n
Ni\u017e\u0161\u00ed provozn\u00ed teploty<\/td>\nPom\u00e1h\u00e1 udr\u017eovat bezpe\u010dn\u00e9 a stabiln\u00ed teploty sou\u010d\u00e1st\u00ed<\/td>\n<\/tr>\n
Del\u0161\u00ed \u017eivotnost<\/td>\nMinimalizuje tepeln\u00e9 nam\u00e1h\u00e1n\u00ed kritick\u00e9 elektroniky<\/td>\n<\/tr>\n
Vy\u0161\u0161\u00ed v\u00fdkon<\/td>\nZabra\u0148uje \u0161krcen\u00ed procesoru nebo tranzistoru MOSFET p\u0159i z\u00e1t\u011b\u017ei<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

To je obzvl\u00e1\u0161t\u011b d\u016fle\u017eit\u00e9 u procesor\u016f pracuj\u00edc\u00edch na vysok\u00fdch frekvenc\u00edch nebo u tranzistor\u016f MOSFET s prom\u011bnn\u00fdm v\u00fdkonem. Oboj\u00ed m\u016f\u017ee bez spr\u00e1vn\u00e9ho tepeln\u00e9ho p\u0159enosu rychle p\u0159ekro\u010dit bezpe\u010dn\u00e9 teploty.<\/p>\n

<\/svg> Pou\u017eit\u00ed tepeln\u00e9 pasty pom\u00e1h\u00e1 zabr\u00e1nit tepeln\u00e9mu throttlingu procesor\u016f.<\/b>Pravda<\/span><\/p>

Zlep\u0161uje p\u0159enos tepla, co\u017e udr\u017euje teploty v rozmez\u00ed v\u00fdkonu.<\/p><\/div>\n

<\/svg> Tepeln\u00e1 pasta je u\u017eite\u010dn\u00e1 pouze pro stoln\u00ed po\u010d\u00edta\u010de.<\/b>False<\/span><\/p>

Je tak\u00e9 nezbytn\u00fd pro servery, vestav\u011bn\u00e9 syst\u00e9my a nap\u00e1jec\u00ed moduly.<\/p><\/div>\n

Jak m\u00e1m spr\u00e1vn\u011b aplikovat nebo vym\u011bnit tepelnou pastu?<\/h2>\n

Mnoho lid\u00ed pou\u017e\u00edv\u00e1 tepelnou pastu nespr\u00e1vn\u011b - bu\u010f p\u0159\u00edli\u0161 mnoho, p\u0159\u00edli\u0161 m\u00e1lo, nebo nerovnom\u011brn\u011b nanesenou. To m\u016f\u017ee v\u00e9st k p\u0159eh\u0159\u00edv\u00e1n\u00ed nebo nepo\u0159\u00e1dku.<\/p>\n

Chcete-li nan\u00e9st tepelnou pastu, o\u010dist\u011bte star\u00e9 zbytky, pou\u017eijte uprost\u0159ed te\u010dku o velikosti hr\u00e1\u0161ku a p\u0159i mont\u00e1\u017ei chladi\u010de zajist\u011bte rovnom\u011brn\u00fd tlak.<\/strong><\/p>\n

Zde je jednoduch\u00fd n\u00e1vod krok za krokem, kter\u00fdm se \u0159\u00edd\u00edm p\u0159i pr\u00e1ci na procesorech nebo desk\u00e1ch s MOSFETy:<\/p>\n

Krok za krokem:<\/h3>\n
    \n
  1. Vypn\u011bte syst\u00e9m.<\/strong> Odpojte v\u0161echny zdroje nap\u00e1jen\u00ed.<\/li>\n
  2. Odstra\u0148te starou tepelnou pastu.<\/strong> Pou\u017eijte izopropylalkohol (90% nebo vy\u0161\u0161\u00ed) a had\u0159\u00edk, kter\u00fd nepou\u0161t\u00ed vl\u00e1kna.<\/li>\n
  3. Naneste novou pastu.<\/strong> Do st\u0159edu \u010dipu k\u00e1pn\u011bte kapku o velikosti hr\u00e1\u0161ku. Nen\u00ed t\u0159eba ji rozt\u00edrat - o to se postar\u00e1 chladi\u010d.<\/li>\n
  4. Znovu namontujte chladi\u010d.<\/strong> Rovnom\u011brn\u00fdm tlakem ji p\u0159itla\u010dte rovnom\u011brn\u011b dol\u016f, aby se pasta rozet\u0159ela.<\/li>\n
  5. Pevn\u011b ji zajist\u011bte.<\/strong> Po kontaktu se vyhn\u011bte posunut\u00ed nebo oto\u010den\u00ed, abyste zabr\u00e1nili vzniku vzduchov\u00fdch mezer.<\/li>\n<\/ol>\n

    D\u00e1vkov\u00e1n\u00ed a nedoporu\u010dov\u00e1n\u00ed:<\/h3>\n\n\n\n\n\n\n\n
    Do<\/th>\nNed\u011blejte to<\/th>\n<\/tr>\n<\/thead>\n
    Pou\u017e\u00edvejte vysoce kvalitn\u00ed pastu<\/td>\nP\u0159\u00edli\u0161 mnoho nebo p\u0159\u00edli\u0161 m\u00e1lo<\/td>\n<\/tr>\n
    P\u0159ed aplikac\u00ed o\u010dist\u011bte povrchy<\/td>\nOp\u011btovn\u00e9 pou\u017eit\u00ed star\u00e9, zaschl\u00e9 pasty<\/td>\n<\/tr>\n
    V\u00fdm\u011bna pasty ka\u017ed\u00e9 1-2 roky<\/td>\nNechat pastu del\u0161\u00ed dobu nepou\u017e\u00edvanou<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

    Nezapome\u0148te tak\u00e9, \u017ee n\u011bkter\u00e9 pasty pot\u0159ebuj\u00ed \u201c\u010das na vytvrzen\u00ed\u201d - tepeln\u00fd v\u00fdkon se zlep\u0161\u00ed po n\u011bkolika hodin\u00e1ch provozu.<\/p>\n

    <\/svg> Tepelnou pastu je v\u017edy nutn\u00e9 rozet\u0159\u00edt ru\u010dn\u011b pomoc\u00ed karty.<\/b>False<\/span><\/p>

    V\u011bt\u0161ina aplikac\u00ed funguje nejl\u00e9pe tak, \u017ee se nanese st\u0159edov\u00e1 te\u010dka a nech\u00e1 se rozprost\u0159\u00edt chladi\u010dem.<\/p><\/div>\n

    <\/svg> P\u0159ed nanesen\u00edm nov\u00e9 pasty byste m\u011bli o\u010distit starou tepelnou pastu.<\/b>Pravda<\/span><\/p>

    Star\u00e1 pasta m\u016f\u017ee vyschnout a sn\u00ed\u017eit p\u0159enos tepla, proto je nutn\u00e9 ji odstranit.<\/p><\/div>\n

    Jak\u00e9 jsou inovace v materi\u00e1lech tepeln\u00fdch rozhran\u00ed?<\/h2>\n

    Tepeln\u00e1 pasta se rychle vyv\u00edj\u00ed. Nov\u00e9 technologie pom\u00e1haj\u00ed za\u0159\u00edzen\u00edm z\u016fstat d\u00e9le chladn\u011bj\u0161\u00ed - s men\u0161\u00edmi n\u00e1roky na \u00fadr\u017ebu.<\/p>\n

    Inovace zahrnuj\u00ed materi\u00e1ly s f\u00e1zovou zm\u011bnou, grafitov\u00e9 desky a pasty na b\u00e1zi nanomateri\u00e1l\u016f, kter\u00e9 zvy\u0161uj\u00ed \u00fa\u010dinnost a usnad\u0148uj\u00ed pou\u017eit\u00ed.<\/strong><\/p>\n

    \"elegantn\u00ed
    Modern\u00ed elegantn\u00ed \u010dern\u00e1 ko\u017een\u00e1 kancel\u00e1\u0159sk\u00e1 \u017eidle s nastavitelnou v\u00fd\u0161kou a ergonomick\u00fdm designem<\/figcaption><\/figure>\n<\/p>\n

    Se zmen\u0161ov\u00e1n\u00edm za\u0159\u00edzen\u00ed a zvy\u0161ov\u00e1n\u00edm hustoty v\u00fdkonu se materi\u00e1ly tepeln\u00e9ho rozhran\u00ed (TIM) st\u00e1vaj\u00ed chyt\u0159ej\u0161\u00edmi a dokonalej\u0161\u00edmi. Zde jsou n\u011bkter\u00e9 ned\u00e1vn\u00e9 inovace:<\/p>\n

    1. Materi\u00e1ly se zm\u011bnou f\u00e1ze (PCM)<\/strong><\/h3>\n

    Tyto pasty tuhnou p\u0159i pokojov\u00e9 teplot\u011b, ale p\u0159i provozn\u00ed teplot\u011b se rozpou\u0161t\u011bj\u00ed a dokonale vypl\u0148uj\u00ed mezery. Jsou ide\u00e1ln\u00ed pro aplikace s konstantn\u00edm tlakem.<\/p>\n

    2. Grafitov\u00e9 podlo\u017eky a f\u00f3lie<\/strong><\/h3>\n

    Grafitov\u00e9 podlo\u017eky, kter\u00e9 se pou\u017e\u00edvaj\u00ed v tenk\u00e9 elektronice, nab\u00edzej\u00ed dobrou tepelnou vodivost bez nepo\u0159\u00e1dku. Snadn\u011bji se aplikuj\u00ed a odstra\u0148uj\u00ed ne\u017e pasta.<\/p>\n

    3. Nano-TIMs<\/strong><\/h3>\n

    Nano\u010d\u00e1stice (nap\u0159. nitrid boru nebo st\u0159\u00edbro) se pou\u017e\u00edvaj\u00ed ke zlep\u0161en\u00ed tepeln\u00e9 vodivosti. Najdeme je v prvot\u0159\u00eddn\u00edch tepeln\u00fdch past\u00e1ch pou\u017e\u00edvan\u00fdch ve vysoce v\u00fdkonn\u00fdch po\u010d\u00edta\u010d\u00edch a datov\u00fdch centrech.<\/p>\n

    4. Neelektricky vodiv\u00e9 tekut\u00e9 kovy<\/strong><\/h3>\n

    Slou\u010deniny na b\u00e1zi galia jsou p\u0159epracov\u00e1v\u00e1ny tak, aby se sn\u00ed\u017eilo elektrick\u00e9 riziko p\u0159i zachov\u00e1n\u00ed vysok\u00e9ho tepeln\u00e9ho v\u00fdkonu.<\/p>\n

    Srovn\u00e1n\u00ed inovac\u00ed TIM:<\/h3>\n\n\n\n\n\n\n\n\n
    Typ<\/th>\nBenefit<\/th>\n<\/tr>\n<\/thead>\n
    Pasta s f\u00e1zovou zm\u011bnou<\/td>\nSamo\u010dinn\u011b se p\u0159izp\u016fsobuje teplu<\/td>\n<\/tr>\n
    Grafitov\u00e1 podlo\u017eka<\/td>\n\u017d\u00e1dn\u00fd nepo\u0159\u00e1dek, snadn\u00e1 v\u00fdm\u011bna<\/td>\n<\/tr>\n
    Nano-TIMs<\/td>\nVynikaj\u00edc\u00ed vodivost pro mal\u00e1 za\u0159\u00edzen\u00ed<\/td>\n<\/tr>\n
    Tekut\u00fd kov (nevodiv\u00fd)<\/td>\nKombinuje extr\u00e9mn\u00ed chlazen\u00ed s bezpe\u010dn\u011bj\u0161\u00ed manipulac\u00ed<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

    Grafitov\u00e9 podlo\u017eky jsem pou\u017e\u00edval v kompaktn\u00edch ovlada\u010d\u00edch bez ventil\u00e1toru se skv\u011bl\u00fdmi v\u00fdsledky - \u017e\u00e1dn\u00e9 rozlit\u00ed, \u017e\u00e1dn\u00fd nepo\u0159\u00e1dek a skv\u011bl\u00fd kontakt. Jsou ide\u00e1ln\u00ed pro st\u00edsn\u011bn\u00e9 prostory, kde by se pasta mohla posunout nebo zaschnout.<\/p>\n

    <\/svg> Grafitov\u00e9 podlo\u017eky jsou alternativou term\u00e1ln\u00ed pasty bez nepo\u0159\u00e1dku.<\/b>Pravda<\/span><\/p>

    Jedn\u00e1 se o pevn\u00e9 desky, kter\u00e9 p\u0159en\u00e1\u0161ej\u00ed teplo, ani\u017e by se \u0161\u00ed\u0159ily.<\/p><\/div>\n

    <\/svg> Pou\u017eit\u00ed tekut\u00e9ho kovu v okol\u00ed citliv\u00fdch obvod\u016f je zcela bezpe\u010dn\u00e9.<\/b>False<\/span><\/p>

    V\u011bt\u0161ina tekut\u00fdch kov\u016f je elektricky vodiv\u00e1 a mus\u00ed se nan\u00e1\u0161et opatrn\u011b.<\/p><\/div>\n

    Z\u00e1v\u011br<\/h2>\n

    Vynech\u00e1n\u00ed term\u00e1ln\u00ed pasty se m\u016f\u017ee zd\u00e1t jako zkratka, ale vede k p\u0159eh\u0159\u00edv\u00e1n\u00ed a krat\u0161\u00ed \u017eivotnosti za\u0159\u00edzen\u00ed. Pochopen\u00ed zp\u016fsobu jej\u00edho pou\u017eit\u00ed - a prozkoum\u00e1n\u00ed modern\u00edch alternativ - zajist\u00ed, \u017ee va\u0161e syst\u00e9my z\u016fstanou bezpe\u010dn\u00e9 a chladn\u00e9.<\/p>","protected":false},"excerpt":{"rendered":"

    Stylish black leather women’s handbag with adjustable strap and gold hardware If you’re tempted to skip thermal paste while mounting your heat sink, stop right there \u2014 it might cost you more than you think. Using a heat sink without thermal paste creates microscopic air gaps that trap heat, leading to thermal inefficiency and possible […]<\/p>\n","protected":false},"author":6,"featured_media":25104,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_seopress_robots_primary_cat":"none","_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","footnotes":""},"categories":[1],"tags":[],"class_list":["post-25106","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-custom-mold"],"meta_box":{"post-to-quiz_to":[]},"_links":{"self":[{"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/posts\/25106","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/comments?post=25106"}],"version-history":[{"count":0,"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/posts\/25106\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/media\/25104"}],"wp:attachment":[{"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/media?parent=25106"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/categories?post=25106"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/sinoextrud.com\/cs\/wp-json\/wp\/v2\/tags?post=25106"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}